The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2014
Filed:
Dec. 29, 2010
Minoru Dooka, Echizen, JP;
Kazunori Kunimoto, Echizen, JP;
Katsunori Ogata, Sabae, JP;
Naohiro Yamada, Echizen, JP;
Minoru Dooka, Echizen, JP;
Kazunori Kunimoto, Echizen, JP;
Katsunori Ogata, Sabae, JP;
Naohiro Yamada, Echizen, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A production method for an electronic chip component includes the steps of forming a first paste layer by applying paste onto a first end surface of an electronic component body with a second end surface being stuck onto a substrate having an adhesive surface and drying the paste, turning the electronic component body 180 degrees so as to stick the first end surface of the electronic component body onto the substrate by sliding a slider relative to the substrate in a state in which the slider is in contact with the first end surface of the electronic component body, forming a second paste layer by applying the paste onto the second end surface of the electronic component body and drying the paste, and firing the first and second paste layers.