The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2014

Filed:

Apr. 29, 2013
Applicant:

Elpida Memory, Inc., Tokyo, JP;

Inventors:

Kayoko Shibata, Tokyo, JP;

Hitoshi Miwa, Tokyo, JP;

Yoshihiko Inoue, Tokyo, JP;

Assignee:

PS4 Luxco S.A.R.L., Luxembourg, LU;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 27/108 (2006.01); G11C 29/12 (2006.01); H01L 23/538 (2006.01); G11C 29/02 (2006.01); G11C 5/06 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); H01L 2924/01019 (2013.01); H01L 2225/06541 (2013.01); H01L 23/481 (2013.01); H01L 2924/01055 (2013.01); H01L 27/10897 (2013.01); G11C 29/12 (2013.01); G11C 29/025 (2013.01); H01L 22/22 (2013.01); H01L 2225/06517 (2013.01); G11C 29/1201 (2013.01); G11C 5/063 (2013.01); H01L 2224/16145 (2013.01); H01L 2924/01037 (2013.01); H01L 2225/06513 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06596 (2013.01);
Abstract

A semiconductor device includes a first semiconductor chip including a plurality of driver circuits and an output switching circuit coupled to the plurality of driver circuits. The device also includes a second semiconductor chip and a plurality of through silicon vias provided on at least one of the first and second semiconductor chips. The output switching circuit is coupled between the plurality of driver circuits and the plurality of the through silicon vias, and outputs each of signals from the plurality of driver circuits to corresponding one of the plurality of through silicon vias.


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