The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8837164 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 16, 2014

Filed:

Jan. 22, 2010
Applicants:

Kazuhiro Kawabata, Higashioumi, JP;

Kiyoshige Miyawaki, Kyoto, JP;

Yoshiaki Ueda, Higashioumi, JP;

Shinji Nakamoto, Higashioumi, JP;

Tsutomu Sugimoto, Higashioumi, JP;

Inventors:

Kazuhiro Kawabata, Higashioumi, JP;

Kiyoshige Miyawaki, Kyoto, JP;

Yoshiaki Ueda, Higashioumi, JP;

Shinji Nakamoto, Higashioumi, JP;

Tsutomu Sugimoto, Higashioumi, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H01L 23/367 (2006.01); H01L 23/36 (2006.01); H01L 23/057 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/36 (2013.01); H01L 23/057 (2013.01); H01L 2924/09701 (2013.01);
Abstract

There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion. The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.


Find Patent Forward Citations

Kawabata, Kazuhiro. (2014). Substrate for mounting device and package for housing device employing the same (U.S. Patent No. 8837164). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8837164

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