The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Nov. 30, 2011
Shinichi Hirose, Kawasaki, JP;
Taisuke Iwai, Kawasaki, JP;
Yoshitaka Yamaguchi, Kawasaki, JP;
Yohei Yagishita, Kawasaki, JP;
Yukie Sakita, Kawasaki, JP;
Masaaki Norimatsu, Kawasaki, JP;
Shinichi Hirose, Kawasaki, JP;
Taisuke Iwai, Kawasaki, JP;
Yoshitaka Yamaguchi, Kawasaki, JP;
Yohei Yagishita, Kawasaki, JP;
Yukie Sakita, Kawasaki, JP;
Masaaki Norimatsu, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method of manufacturing an electronic component includes disposing a heat radiation material including a plurality of linear structures of carbon atoms and a filling layer of a thermoplastic resin provided among the plurality of linear structures above a first substrate, disposing a blotting paper above the heat radiation material, making a heat treatment at a temperature higher than a melting temperature of the thermoplastic resin and absorbing the thermoplastic resin above the plurality of linear structures with the absorption paper, removing the blotting paper, and adhering the heat radiation material to the first substrate by cooling to solidify the thermoplastic resin.