The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Sep. 23, 2011
Applicant:
Kwon Whan Han, Seoul, KR;
Inventor:
Kwon Whan Han, Seoul, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 15/08 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); H01L 2924/00015 (2013.01); H01L 2924/3512 (2013.01); H01L 24/81 (2013.01); H01L 2224/14515 (2013.01); H01L 2224/81007 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/10122 (2013.01); H01L 24/14 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81191 (2013.01);
Abstract
A semiconductor chip includes a semiconductor chip body having a first surface and a second surface that faces away from the first surface, and including a plurality of bonding pads disposed on the first surface. Also, the semiconductor chip includes a distance maintaining member attached to the first surface of the semiconductor chip body and electrically connected with a circuit pattern.