The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2014

Filed:

Jun. 04, 2012
Applicants:

Fabio Alessio Marino, San Jose, CA (US);

Paolo Menegoli, San Jose, CA (US);

Inventors:

Fabio Alessio Marino, San Jose, CA (US);

Paolo Menegoli, San Jose, CA (US);

Assignee:

Eta Semiconductor Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 21/02 (2006.01); H01L 27/06 (2006.01); H01L 27/092 (2006.01); H01L 29/778 (2006.01); H01L 21/8258 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0243 (2013.01); H01L 29/78 (2013.01); H01L 21/0254 (2013.01); H01L 21/0245 (2013.01); H01L 29/2003 (2013.01); H01L 21/02546 (2013.01); H01L 27/0605 (2013.01); H01L 27/092 (2013.01); H01L 21/02494 (2013.01); H01L 29/7787 (2013.01); H01L 21/8258 (2013.01); H01L 21/02381 (2013.01); H01L 21/02458 (2013.01); H01L 21/02472 (2013.01);
Abstract

The present invention describes a hybrid integrated circuit comprising both CMOS and III-V devices, monolithically integrated in a single chip. It allows the almost complete elimination of the contamination issues related to the integration of different technologies, maintaining at the same time a good planarization of the structure. It further simplifies the fabrication process, allowing the growth of high quality III-V materials on (100) silicon substrates lowering the manufacturing cost. Moreover, differently from many prior art attempts, it does not require silicon on insulator technologies and/or other expensive process steps. This invention enables the consolidation on the same integrated circuit of a hybrid switching power converter that takes advantage of the established circuit topologies of CMOS circuitries and of the higher mobility and voltage withstanding of III-V HEMT devices.


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