The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8835915 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 16, 2014

Filed:

Nov. 17, 2011
Applicants:

Robert S. Clough, St. Paul, MN (US);

James C. Novack, Hudson, WI (US);

David H. Redinger, Aston, MN (US);

Guoping Mao, Woodbury, MN (US);

Michael E. Griffin, Maplewood, MN (US);

Inventors:

Robert S. Clough, St. Paul, MN (US);

James C. Novack, Hudson, WI (US);

David H. Redinger, Aston, MN (US);

Guoping Mao, Woodbury, MN (US);

Michael E. Griffin, Maplewood, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/05 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0537 (2013.01); H01L 51/0055 (2013.01); H01L 51/052 (2013.01); H01L 51/0094 (2013.01); H01L 51/004 (2013.01);
Abstract

An assembly includes a dielectric layer in contact with a semiconductor layer. The dielectric layer includes a crosslinked polymeric material having isocyanurate groups, wherein the dielectric layer is free of zirconium oxide particles. The semiconductor layer includes a non-polymeric organic semiconductor material, and is substantially free of electrically insulating polymer. Electronic components and devices including the assembly are also disclosed.


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