The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Sep. 20, 2012
Mathias Bruendel, Stuttgart, DE;
Frieder Haag, Wannweil, DE;
Jens Frey, Filderstadt, DE;
Rolf Speicher, Tuebingen, DE;
Juergen Fritz, Reutlingen, DE;
Lutz Rauscher, Reutlingen, DE;
Mathias Bruendel, Stuttgart, DE;
Frieder Haag, Wannweil, DE;
Jens Frey, Filderstadt, DE;
Rolf Speicher, Tuebingen, DE;
Juergen Fritz, Reutlingen, DE;
Lutz Rauscher, Reutlingen, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A method for producing a two-chip assembly includes: providing a wafer having a first thickness, which wafer has a front side and a back side, a first plurality of first chips being provided on the front side of the wafer; attaching a second plurality of second chips on the front side of the wafer, so that every first chip is joined in each instance to a second chip and forms a corresponding two-chip pair; forming a cohesive mold package on the front side of the wafer, so that the second chips are packaged; thinning the wafer from the back side to a second thickness which is less than the first thickness; forming vias from the back side to the second chips; and separating the two-chip pairs into corresponding two-chip assemblies.