The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2014

Filed:

Jan. 22, 2009
Applicants:

Justin R. Hawkes, Marlborough, CT (US);

Sergei F. Burlatsky, West Hartford, CT (US);

Sunil G. Warrier, Middletown, CT (US);

Shubhro Ghosh, Manchester, CT (US);

Jean Colpin, Avon, CT (US);

Inventors:

Justin R. Hawkes, Marlborough, CT (US);

Sergei F. Burlatsky, West Hartford, CT (US);

Sunil G. Warrier, Middletown, CT (US);

Shubhro Ghosh, Manchester, CT (US);

Jean Colpin, Avon, CT (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 8/10 (2006.01); H01M 8/12 (2006.01); H01M 8/02 (2006.01); H01M 4/86 (2006.01);
U.S. Cl.
CPC ...
H01M 8/1226 (2013.01); Y02E 60/525 (2013.01); H01M 4/8657 (2013.01); Y02E 60/521 (2013.01); H01M 8/0254 (2013.01); H01M 8/0228 (2013.01); H01M 2008/1293 (2013.01); H01M 8/0245 (2013.01); H01M 8/0232 (2013.01); H01M 2004/8689 (2013.01);
Abstract

A fuel cell includes a cell having a solid oxide electrolyte between electrodes. The cell has a first coefficient of thermal expansion. A metallic support is in electrical connection with one of the electrodes. The metallic support includes a metal substrate and a compliant porous nickel layer that is bonded to the metal substrate between the cell and the metal substrate. The metal substrate has a second coefficient of thermal expansion that nominally matches the first coefficient of thermal expansion of the cell. The metal substrate has a first stiffness and the compliant porous nickel layer has a second stiffness that is less than the first stiffness such that the compliant porous nickel layer can thermally expand and contract with the metal substrate.


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