The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2014

Filed:

Nov. 05, 2009
Applicants:

So-won Kim, Daejeon, KR;

Woo-ram Lee, Daejeon, KR;

Sang-ho Kim, Daejeon, KR;

Inventors:

So-Won Kim, Daejeon, KR;

Woo-Ram Lee, Daejeon, KR;

Sang-Ho Kim, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 (2006.01); H05K 1/09 (2006.01); C23C 18/12 (2006.01); C23C 18/40 (2006.01); C09D 5/24 (2006.01); C09D 7/12 (2006.01); C09D 11/52 (2014.01); C08K 3/22 (2006.01); C08K 9/04 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); C23C 18/1262 (2013.01); B05D 5/12 (2013.01); C23C 18/40 (2013.01); C23C 18/1295 (2013.01); C23C 18/127 (2013.01); C08K 3/22 (2013.01); C08K 9/04 (2013.01); C09D 5/24 (2013.01); C09D 7/1225 (2013.01); C09D 7/1275 (2013.01); C09D 7/1283 (2013.01); C09D 11/52 (2013.01); H05K 1/097 (2013.01); H05K 3/1291 (2013.01); H05K 2203/1126 (2013.01); H05K 2203/1157 (2013.01);
Abstract

A method for preparing an electroconductive patterned copper layer, comprising mixing copper-based particles with a reducing agent, and then adding a solvent thereto to prepare a reducing agent-containing copper-based particle dispersion solution; printing on or filling in the reducing agent-containing copper-based particle dispersion solution a substrate in a predetermined shape to form a reducing agent-containing copper-based particle patterned layer; and firing the reducing agent-containing copper-based particle patterned layer in the air, which allows forming a patterned copper layer with excellent electric conductivity even in the air, thereby being industrially very useful.


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