The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2014

Filed:

Oct. 01, 2009
Applicants:

Liang-you Jiang, Taipei County, TW;

Janglin Chen, Kaohsiung County, TW;

Yu-yang Chang, Hsinchu County, TW;

Dong-sen Chen, Yunlin County, TW;

Inventors:

Liang-You Jiang, Taipei County, TW;

Janglin Chen, Kaohsiung County, TW;

Yu-Yang Chang, Hsinchu County, TW;

Dong-Sen Chen, Yunlin County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/00 (2006.01); H01L 21/683 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
B32B 37/0076 (2013.01); H01L 21/6835 (2013.01); B32B 2457/20 (2013.01); H01L 2221/68345 (2013.01); G02F 2001/133302 (2013.01);
Abstract

A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate.


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