The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Feb. 20, 2012
Soichiro Kato, Fujisawa, JP;
Ryoichi Sato, Fujisawa, JP;
Soichiro Kato, Fujisawa, JP;
Ryoichi Sato, Fujisawa, JP;
NSK Ltd., Tokyo, JP;
Abstract
In a linear motion guide device suitably applicable to applications under high-temperature and vacuum environments where no plastic end cap is applicable, and having an end cap formed by injection molding using metal powders as a raw material, the degree of adhesion of the metal powders is improved at a thin and keen portion like the scooping portion of the end cap, thereby suppressing an abrasion and a deformation. The end cap () is formed by injection molding (MIM: Metal Injection Molding) using metal powders of equal to or less than 20 μm as a raw material, and has a scooping portion () having undergone an HIP (Hot-Isostatic-Pressing) process and a thermal process.