The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8833923 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 16, 2014

Filed:

Dec. 14, 2011
Applicants:

Kentaro Mori, Inuyama, JP;

Daisuke Uematsu, Aichi-gun, JP;

Nobuhiro Hayakawa, Chita, JP;

Inventors:

Kentaro Mori, Inuyama, JP;

Daisuke Uematsu, Aichi-gun, JP;

Nobuhiro Hayakawa, Chita, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/01 (2006.01); B41J 2/17 (2006.01); B41J 3/407 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1258 (2013.01); H05K 3/125 (2013.01);
Abstract

There is provided a method for forming a conductor, including a first printing step of printing a contour part of the conductor with a first printing ink, a drying step of drying the printed contour part, and a second printing step of printing a remaining part of the conductor with a second printing ink, wherein the second printing ink contains a conductive material and has a surface tension lower than or equal to a surface tension of the first printing ink.


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Mori, Kentaro. (2014). Conductor forming method (U.S. Patent No. 8833923). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8833923

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