The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
Feb. 17, 2012
Shinichi Miyazaki, Kobe, JP;
Junichi Kodama, Futtsu, JP;
Yasuo Sakai, Utsunomiya, JP;
Keisuke Aramaki, Utsunomiya, JP;
Yuichi Sano, Utsunomiya, JP;
Kenichi Okamoto, Itami, JP;
Shinichi Miyazaki, Kobe, JP;
Junichi Kodama, Futtsu, JP;
Yasuo Sakai, Utsunomiya, JP;
Keisuke Aramaki, Utsunomiya, JP;
Yuichi Sano, Utsunomiya, JP;
Kenichi Okamoto, Itami, JP;
Sumitomo Rubber Industries, Ltd., Kobe, JP;
Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;
Sumitomo (SEI) Steel Wire Corp., Hyogo, JP;
Abstract
Rubber-cord complexhaving improved wet heat adhesive property between rubber and cord. The rubber-cord complex includes cordcomprising drawn plated wireprepared by providing brass plated layerE on surface of element wireand drawing the resulting plated wire and rubbervulcanized and bonded to cord. The rubber-cord complexhas adhesion reaction layer(formed by cross-linking sulfur and copper) between rubberand brass plated layerE. Adhesion reaction layerhas average thickness of 50-1,000 nm. Interface S between adhesion reaction layerand the rubber has a fractal dimension of 1.001-1.300 in a wet heat deterioration state after being subjected to vulcanization to bond rubberthereto and being held at a temperature of 50-100° C. and a humidity of 60-100% for one hour to 20 days.