The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2014
Filed:
May. 16, 2012
Kyung Ho Lee, Gyunggi-do, KR;
SE Min OH, Gyunggi-do, KR;
Chang Hwan Choi, Gyunggi-do, KR;
Choon Keun Lee, Gyunggi-do, KR;
Jeong Yeol Moon, Kyungsangnam-do, KR;
Jong Rip Kim, Gyunggi-do, KR;
Kyung Ho Lee, Gyunggi-do, KR;
Se Min Oh, Gyunggi-do, KR;
Chang Hwan Choi, Gyunggi-do, KR;
Choon Keun Lee, Gyunggi-do, KR;
Jeong Yeol Moon, Kyungsangnam-do, KR;
Jong Rip Kim, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method of manufacturing a flexible printed circuit board including determining an elastic modulus of a conductive portion and an elastic modulus of first and second dielectric portions, determining a thickness of the conductive portion and the first and second dielectric portions so that a neutral plane is located within a predetermined range of the thickness of the conductive portion, the neutral plane being substantially free from tension or compression in response to bending of the flexible printed circuit board, and insulating the conductive portion according to the determined thickness and the determined elastic modulus.