The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

Dec. 21, 2011
Applicants:

Satao Hirabayashi, Annaka, JP;

Nobumasa Tomizawa, Annaka, JP;

Noriyuki Meguriya, Annaka, JP;

Inventors:

Satao Hirabayashi, Annaka, JP;

Nobumasa Tomizawa, Annaka, JP;

Noriyuki Meguriya, Annaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03G 15/20 (2006.01); B32B 5/30 (2006.01); C08G 77/04 (2006.01); C08J 9/32 (2006.01); C08K 7/22 (2006.01); C08L 83/04 (2006.01); C08J 9/00 (2006.01); C08G 77/20 (2006.01); C08G 77/12 (2006.01);
U.S. Cl.
CPC ...
G03G 15/2017 (2013.01); C08G 77/20 (2013.01); G03G 2215/2051 (2013.01); C08J 9/32 (2013.01); C08J 2383/07 (2013.01); C08J 2483/05 (2013.01); C08K 7/22 (2013.01); C08K 2201/001 (2013.01); C08L 83/04 (2013.01); C08J 9/0061 (2013.01); C08J 2201/026 (2013.01); C08J 9/0066 (2013.01); C08G 77/12 (2013.01);
Abstract

A thermally conductive silicone rubber sponge composition which is composed of 100 parts by weight of heat-curable organopolysiloxane composition, 0.1 to 50 parts by weight of organic resin hollow filler having an average particle diameter of up to 200 μm and a true specific gravity of up to 0.3, and 20 to 300 parts by weight of thermally conductive filler having an average particle diameter of 1 to 30 μm and a thermal conductivity of at least 15 W/m·K, with the highly thermally conductive silicone rubber sponge having voids accounting for 10 to 70% of the entire volume thereof. The silicone rubber sponge composition of the present invention gives a silicone rubber sponge having high thermal conductivity, small heat capacity, low hardness, light weight, and low permanent compression set.


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