Method for testing a partially assembled multi-die device, integrated circuit die and multi-die device

Abstract

The present invention discloses a method of testing a partially assembled multi-die device () by providing a carrier () comprising a device-level test data input () and a device-level test data output (); placing a first die on the carrier, the first die having a test access port () comprising a primary test data input (), a secondary test data input () and a test data output (), the test access port being controlled by a test access port controller (); communicatively coupling the secondary test data input () of the first die to the device-level test data input (), and the test data output () of the first die to the device-level test data output (); providing the first die with configuration information to bring the first die in a state in which the first die accepts test instructions from its secondary test data input (); testing the first die, said testing including providing the secondary test data input () of the first die with test instructions through the device-level test data input (); and collecting a test result for the first die on the device-level test data output (). Consequently, a die of a partially assembled multi-die device such as a System-in-Package may be tested using its integrated boundary scan test architecture.