The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

Mar. 23, 2012
Applicants:

Koichi Yamamoto, Kanagawa, JP;

Takehito Hirose, Aichi, JP;

Shigeru Teshigahara, Gifu, JP;

Inventors:

Koichi Yamamoto, Kanagawa, JP;

Takehito Hirose, Aichi, JP;

Shigeru Teshigahara, Gifu, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/46 (2010.01); H01L 25/075 (2006.01); H05K 3/28 (2006.01); G02F 1/1335 (2006.01); H05K 3/00 (2006.01); H01L 33/54 (2010.01); H01L 33/64 (2010.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H05K 3/0061 (2013.01); H05K 2201/0209 (2013.01); H01L 33/60 (2013.01); H01L 2224/49107 (2013.01); H01L 33/54 (2013.01); H01L 33/64 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/48091 (2013.01); H05K 2201/10106 (2013.01); H01L 2224/48464 (2013.01); H05K 3/28 (2013.01); H05K 1/189 (2013.01); G02F 1/133603 (2013.01); H05K 2201/2054 (2013.01);
Abstract

There are provided a light-source circuit unit, an illumination device, and a display device which are capable of extracting light emitted from the back surface of a light-emitting element chip to the front surface, suppressing a reduction in reflectance, and reducing cost, with a simple configuration. The light-source circuit unit includes a circuit substrate that has a light-reflective wiring pattern on a surface thereof and includes a chip mounting layer as a part of the wiring pattern, and one or more light-emitting element chips that are directly placed on the chip mounting layer, and are driven by a current flowing through the wiring pattern.


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