The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Dec. 29, 2010
Ki Young Kim, Seongnam-si, KR;
Sung Ho Hyun, Seoul, KR;
Myung Gun Park, Seoul, KR;
Jin Ho Bae, Icheon-si, KR;
Ki Young Kim, Seongnam-si, KR;
Sung Ho Hyun, Seoul, KR;
Myung Gun Park, Seoul, KR;
Jin Ho Bae, Icheon-si, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
A module substrate may include a substrate body on which a plurality of chip mounting regions having connection pads are defined. Repair structures may be respectively formed, or placed, in the chip mounting regions. Each repair structure includes conductive layer patterns formed over the connection pads in each chip mounting region, an insulation layer pattern formed over the substrate body in each chip mounting region in such a way as to expose the conductive layer patterns, plastic conductive members formed between the connection pads and the conductive layer patterns, and a plastic insulation member formed between the substrate body and the insulation layer pattern in each chip mounting region.