The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

Jan. 02, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Stephen P. Ayotte, Bristol, VT (US);

David J. Hill, Richmond, VT (US);

Timothy M. Sullivan, Essex, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/17 (2013.01);
Abstract

Stacked multichip packages and methods of making multichip packages. A method includes using a boat having different depth openings corresponding to the length of column interconnections of the completed multichip package and masks to place proper length columns in the corresponding depth openings; placing an integrated circuit chip on the boat and attaching exposed upper ends of the columns to respective chip pads of the integrated circuit using a first solder reflow process and attaching a preformed package substrate integrated circuit chip stack to the integrated circuit and attached columns using a second solder reflow process.


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