The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

Dec. 21, 2011
Applicants:

Yutaka Hotta, Chiryu, JP;

Tatsuyuki Uechi, Toyoake, JP;

Inventors:

Yutaka Hotta, Chiryu, JP;

Tatsuyuki Uechi, Toyoake, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/40 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 23/4006 (2013.01); H01L 23/473 (2013.01); H05K 7/20927 (2013.01);
Abstract

A semiconductor device configured to enable efficient cooling of an element and downsizing of the device. The semiconductor device including an element unit connected to a surface of a cooler. A support member that has a condenser housing chamber that houses the condenser. The condenser has two parallel planar surfaces that are parallel with each other. The condenser housing chamber has a parallel opposing surface that is arranged in parallel with the element unit arrangement surface and faces the element unit arrangement surface, and houses the condenser in a state where the two parallel planar surfaces are arranged in parallel with the parallel opposing surface. The support member is fixed to the cooler in a state where the parallel opposing surface presses the element unit toward the cooler.


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