The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Sep. 13, 2012
Applicants:
Hyun Joo Kim, Icheon-si, KR;
Kang Won Lee, Icheon-si, KR;
Gyu Jei Lee, Seoul, KR;
Inventors:
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor substrate includes a substrate body divided into device regions and a peripheral region outside the device region, and having one surface, another surface substantially facing away from the one surface, trenches defined in the device regions under the one surface and inner surfaces which are formed due to defining of the trenches; active regions formed in the trenches; and a gettering layer formed between the inner surfaces of the substrate body and the active regions.
Kim, Hyun. (2014). Semiconductor substrate, semiconductor chip having the same, and stacked semiconductor package (U.S. Patent No. 8829657). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8829657
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile