The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
May. 25, 2011
Applicants:
Masahiro Sakuragi, Kyoto, JP;
Toma Fujita, Kyoto, JP;
Mizuho Okada, Kyoto, JP;
Inventors:
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); B81C 1/00 (2006.01); H01L 21/762 (2006.01); G01L 9/00 (2006.01);
U.S. Cl.
CPC ...
G01L 9/0042 (2013.01); B81C 1/00158 (2013.01); H01L 21/76283 (2013.01); B81B 2201/0264 (2013.01); B81C 2201/014 (2013.01); H01L 21/76264 (2013.01); B81B 2203/0127 (2013.01);
Abstract
[Subject] To provide a pressure sensor capable of implementing cost reduction and miniaturization. [Solving Means] A pressure sensorincludes a silicon substrateprovided therein with a reference pressure chamber, a diaphragm, consisting of part of the silicon substrate, formed on a surface layer portion of the silicon substrateto partition a reference pressure chamber, and an etching stop layerformed on a lower surface of the diaphragmfacing the reference pressure chamber. A through-holecommunicating with the reference pressure chamberis formed on the diaphragm, and a filleris arranged in the through-hole