The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Jan. 30, 2013
Applicant:
Kenji Hatori, Tokyo, JP;
Inventor:
Kenji Hatori, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/76 (2006.01); H01L 29/739 (2006.01); H01L 29/08 (2006.01); H01L 29/06 (2006.01); H01L 29/36 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7395 (2013.01); H01L 29/0834 (2013.01); H01L 29/7397 (2013.01); H01L 29/36 (2013.01); H01L 29/0696 (2013.01);
Abstract
Provided is a power semiconductor device including a semiconductor substrate, in which a current flows in a thickness direction of the semiconductor substrate. The semiconductor substrate includes a resistance control structure configured so that a resistance to the current becomes higher in a central portion of the semiconductor substrate than a peripheral portion of the semiconductor substrate.