The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

Sep. 22, 2011
Applicants:

Yang-kuao Kuo, Taoyuan County, TW;

Chin-peng Wang, Taoyuan County, TW;

Lea-hwung Leu, Taoyuan County, TW;

Inventors:

Yang-Kuao Kuo, Taoyuan County, TW;

Chin-Peng Wang, Taoyuan County, TW;

Lea-Hwung Leu, Taoyuan County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); F21V 29/00 (2006.01); H05K 1/02 (2006.01); F21V 23/00 (2006.01); H05B 33/08 (2006.01); H05K 1/03 (2006.01); H01L 25/075 (2006.01); H05K 3/00 (2006.01); F21Y 101/02 (2006.01); F21Y 105/00 (2006.01);
U.S. Cl.
CPC ...
F21V 23/005 (2013.01); H05K 1/0306 (2013.01); H05K 2201/10106 (2013.01); F21V 29/004 (2013.01); H01L 25/0753 (2013.01); Y02B 20/341 (2013.01); H05K 1/0203 (2013.01); H05K 3/0061 (2013.01); F21Y 2101/02 (2013.01); F21V 29/225 (2013.01); H05B 33/0803 (2013.01); F21V 29/246 (2013.01); F21Y 2105/001 (2013.01);
Abstract

Disclosed is an integrated apparatus including an isolative substrate, a plurality of driver chips provided on a side of the isolative substrate, a power supply provided on the side of the isolative substrate and electrically connected to the driver chips, and LED chips provided on another side of the isolative substrate and electrically connected to the driver chips. Thus, the driver chips, the power supply and the LED chips are integrated on the isolative substrate. The production is easy. The integrated apparatus is not vulnerable to surges and lightning strikes. Electromagnetic interferences are reduced. Heat radiation of the integrated apparatus is excellent so that the LED chips are protected from thermal effect.


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