The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Apr. 16, 2009
Applicants:
Andreas Kramer, Zurich, CH;
Jurgen Finter, Zurich, CH;
Karsten Frick, Remetschwil, CH;
Jan Olaf Schulenburg, Uster, CH;
Inventors:
Andreas Kramer, Zurich, CH;
Jurgen Finter, Zurich, CH;
Karsten Frick, Remetschwil, CH;
Jan Olaf Schulenburg, Uster, CH;
Assignee:
Sika Technology AG, Baar, CH;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 71/04 (2006.01); C08L 53/00 (2006.01); B32B 37/12 (2006.01); C08G 18/40 (2006.01); C08G 18/80 (2006.01); C08G 18/10 (2006.01); C08G 18/28 (2006.01); C08L 63/00 (2006.01); C08G 59/40 (2006.01); C08G 18/75 (2006.01); C08G 18/67 (2006.01); C08G 18/48 (2006.01); C09J 163/00 (2006.01); C08L 75/08 (2006.01); C08K 3/00 (2006.01); C08K 5/00 (2006.01); C08L 75/04 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08G 18/4018 (2013.01); C08G 18/808 (2013.01); C08G 18/10 (2013.01); C08G 18/2865 (2013.01); C08L 75/08 (2013.01); C08L 2205/03 (2013.01); C08K 3/0033 (2013.01); C08L 63/00 (2013.01); C08G 59/4021 (2013.01); C08K 5/0016 (2013.01); C08G 18/755 (2013.01); C08G 18/6715 (2013.01); C08G 18/4866 (2013.01); C08L 75/04 (2013.01);
Abstract
Novel impact strength modifiers which are obtained by reaction of amphiphilic block copolymers. These impact strength modifiers are suitable in particular for use in heat-curing epoxy resin adhesives. In particular, combinations of different impact strength modifiers are also suitable for use in heat-curing epoxy resin adhesives. Also disclosed are methods of bonding heat-stable substrates.