The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Jun. 25, 2013
Applicant:
Lam Research Corporation, Fremont, CA (US);
Inventors:
William T. Lee, Dublin, CA (US);
Xiaomin Bin, Fremont, CA (US);
Assignee:
Lam Research Corporation, Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/768 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76834 (2013.01); H01L 21/76874 (2013.01); H01L 21/76865 (2013.01); H01L 21/76871 (2013.01); H01L 21/76873 (2013.01); H01L 21/76843 (2013.01); H01L 21/28562 (2013.01); H01L 21/76841 (2013.01);
Abstract
A method for providing metal filled features in a layer is provided. A nonconformal metal seed layer is deposited on tops, sidewalls, and bottoms of the features, wherein more seed layer is deposited on tops and bottoms of features than sidewalls. The metal seed layer are etched back on tops, sidewalls, and bottoms of the features, wherein some metal seed layer remains on tops and bottoms of the features. Deposition on the seed layer on tops of the features is suppressed. An electroless 'bottom up' deposition of metal is provided to fill the features.