The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Jul. 26, 2011
Applicant:
Philip S. NG, Cupertino, CA (US);
Inventor:
Philip S. Ng, Cupertino, CA (US);
Assignee:
Atmel Corporation, San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/561 (2013.01); H01L 23/3114 (2013.01); H01L 2224/131 (2013.01); H01L 24/13 (2013.01); H01L 2224/94 (2013.01);
Abstract
The disclosed WLCSP solution overcomes the limitations of fan-out WLCSP solutions, and other conventional solutions for WLCSP for small, high volume die, by increasing the width of scribe regions between die on a semiconductor substrate to accommodate bonding structures (e.g., solder balls) that partially extend beyond peripheral edges of the die. The scribe regions can be widened in x and y directions on the wafer. The widened scribe regions can be incorporated into the design of the mask set.