The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Jul. 17, 2013
Infineon Technologies Ag, Neubiberg, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of packaging integrated circuits includes providing a molded substrate including a first plurality of functional semiconductor dies and a plurality of placeholders laterally spaced apart from one another and covered by a molding compound. The molding compound is thinned to expose at least some of the placeholders. The exposed placeholders are removed to form cavities in the molded substrate. A second plurality of functional semiconductor dies is inserted in the cavities formed in the molded substrate. Electrical connections are formed to the first plurality and second plurality of functional semiconductor dies at a side of the dies uncovered by the molding compound.