The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
May. 28, 2010
Applicant:
Kazuaki Sumita, Annaka, JP;
Inventor:
Kazuaki Sumita, Annaka, JP;
Assignee:
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); C08G 59/50 (2006.01); C08K 3/00 (2006.01); C08L 63/00 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01); C08K 9/06 (2006.01); C08K 5/00 (2006.01); C08K 5/1515 (2006.01); C08K 5/5435 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 2924/01012 (2013.01); C08G 59/5033 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/32145 (2013.01); C08K 9/06 (2013.01); C08K 3/0033 (2013.01); C08K 5/0025 (2013.01); C08K 5/1515 (2013.01); H01L 2224/73203 (2013.01); C08K 5/5435 (2013.01); H01L 2924/01019 (2013.01); C08L 63/00 (2013.01); H01L 2924/10253 (2013.01); H01L 23/295 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/26175 (2013.01); H01L 2924/12044 (2013.01);
Abstract
A composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler having an average particle size of 0.1-10 μm and a maximum particle size of up to 75 μm, and (D) a surface-silylated silica having an average particle size of 0.005 μm to less than 0.1 μm is suited as a dam composition for use with a underfill material in the fabrication of multilayer semiconductor packages.