The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Sep. 22, 2011
Applicant:
Seong-deok Hwang, Seoul, KR;
Inventor:
Seong-deok Hwang, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd, Suwon-Si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/22 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 2933/0066 (2013.01); H01L 2924/0002 (2013.01); H01L 33/486 (2013.01); H01L 33/0079 (2013.01); H01L 33/22 (2013.01);
Abstract
A wafer level light-emitting device package may include a polymer layer that bonds a light-emitting structure to a package substrate, and the polymer layer and the package substrate may include a plurality of via holes. Also, a method of manufacturing the wafer level light-emitting device package may include forming the polymer layer on the light-emitting structure, bonding the package substrate onto the polymer layer by applying heat and pressure, and forming a plurality of via holes in the polymer layer and the package substrate.