The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

Dec. 28, 2007
Applicants:

Tae Sub Bae, Suwon-si, KR;

Jin Gyu Park, Seoul, KR;

Jung Bae Jun, Gunpo-si, KR;

Jae Ho Lee, Yongin-si, KR;

Jung IL Park, Incheon-si, KR;

Sang Woon Lee, Seoul, KR;

Inventors:

Tae Sub Bae, Suwon-si, KR;

Jin Gyu Park, Seoul, KR;

Jung Bae Jun, Gunpo-si, KR;

Jae Ho Lee, Yongin-si, KR;

Jung Il Park, Incheon-si, KR;

Sang Woon Lee, Seoul, KR;

Assignee:

Cheil Industries Inc., Gumi-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01); B05D 3/04 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/323 (2013.01); H05K 2201/0221 (2013.01); H05K 2201/0233 (2013.01);
Abstract

Disclosed herein are anisotropic conductive particles having superior electrical reliability which are useful as materials for electrical connection structures. Further disclosed is a method for preparing conductive particles comprising polymer resin base particles and a conductive complex metal plating layer formed on the surface of the base particles wherein the conductive complex metal plating layer has a substantially continuous density gradient and can include nickel (Ni) and gold (Au).


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