The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8828260 B1

PDF
Full Text
Expired
Date of Patent:
Sep. 09, 2014

Filed:

Jul. 19, 2011
Applicants:

Hideki Shimoi, Hamamatsu, JP;

Keisuke Araki, Hamamatsu, JP;

Inventors:

Hideki Shimoi, Hamamatsu, JP;

Keisuke Araki, Hamamatsu, JP;

Assignee:

Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); B23K 26/00 (2014.01); B23K 26/38 (2014.01); B23K 26/40 (2014.01); B23K 26/06 (2014.01); H01L 21/306 (2006.01); B23K 26/073 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
B23K 26/381 (2013.01); B23K 26/006 (2013.01); B23K 26/383 (2013.01); B23K 26/0057 (2013.01); B23K 26/0042 (2013.01); H01L 21/76898 (2013.01); B23K 26/4075 (2013.01); B23K 26/0639 (2013.01); H01L 21/30608 (2013.01); B23K 26/0736 (2013.01);
Abstract

A substrate processing method for forming a space extending along a predetermined line in a silicon substrate includes a first step of converging a laser light which is an elliptically-polarized light having an ellipticity other than 1 at the substrate so as to form a plurality of modified spots within the substrate along the line and produce a modified region including the modified spots, and a second step of anisotropically etching the substrate so as to advance an etching selectively along the modified region and form the space in the substrate. In the first step, the light is converged at the substrate such that a moving direction of the light with respect to the substrate and a direction of polarization of the light form an angle of 45° or greater therebetween, and the modified spots are made align in one row along the line.


Find Patent Forward Citations

Shimoi, Hideki. (2014). Substrate processing method (U.S. Patent No. 8828260). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8828260

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