The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

May. 25, 2011
Applicants:

Jong-bae Park, Gyeongsangbuk-do, KR;

Pil-woo Lee, Gyeongsangbuk-do, KR;

Jong-hwa Kim, Gyeongsangbuk-do, KR;

Hak-ju Kim, Gyeonggi-do, KR;

Jung-won Cho, Gyeongsangbuk-do, KR;

Inventors:

Jong-Bae Park, Gyeongsangbuk-do, KR;

Pil-Woo Lee, Gyeongsangbuk-do, KR;

Jong-Hwa Kim, Gyeongsangbuk-do, KR;

Hak-Ju Kim, Gyeonggi-do, KR;

Jung-Won Cho, Gyeongsangbuk-do, KR;

Assignee:

Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C03C 15/00 (2006.01); B32B 5/16 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/00 (2013.01);
Abstract

A method for finishing an exterior surface of an injection-molded product is provided, in which a metal layer is formed on the exterior surface of the injection-molded product, a photoresist layer is formed on the metal layer, a photomask is placed on the photoresist layer, light is projected onto the photomask, and remaining parts of the metal layer and the photoresist layer except for parts corresponding to a pattern formed on the photomask are removed by etching.


Find Patent Forward Citations

Loading…