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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8827547 B1

PDFFull Text
Expired
Date of Patent:
Sep. 09, 2014

Filed:

Mar. 12, 2013

Fluid distribution method facilitating cooling of electronics rack(s) and simulating heated airflow exhaust of electronics rack(s)

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Matthew R. Archibald, Morrisville, NC (US);

Richard C. Chu, Hopewell Junction, NY (US);

Hendrik Hamann, Yorktown Heights, NY (US);

Madhusudan K. Iyengar, Foster City, CA (US);

Roger R. Schmidt, Poughkeepsie, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

Dennis Jung, Esq.

Kevin P. Radigan, Esq.

Heslin Rothenberg Farley & Mesiti P.C.

Primary Examiner:

Gail Verbitsky

Int. Cl.
CPC ...
G01K 1/12 (2006.01); G01K 1/16 (2006.01); G01K 13/10 (2006.01); G01K 17/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

Find Patent Forward Citations

Archibald, Matthew. (2014). Fluid distribution method facilitating cooling of electronics rack(s) and simulating heated airflow exhaust of electronics rack(s) (U.S. Patent No. 8827547). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8827547

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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