The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

Oct. 22, 2010
Applicant:

E. Mikhail Sagal, Wakefield, RI (US);

Inventor:

E. Mikhail Sagal, Wakefield, RI (US);

Assignee:

Thermal Solution Resources, LLC, Narragansett, RI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 99/00 (2010.01); F21V 15/01 (2006.01); F21V 31/04 (2006.01); B29C 45/14 (2006.01); F21V 29/00 (2006.01); F21V 19/00 (2006.01); B29C 45/00 (2006.01); F21Y 101/02 (2006.01); F21V 17/16 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14 (2013.01); F21K 9/137 (2013.01); F21V 15/011 (2013.01); F21V 29/2231 (2013.01); F21V 29/244 (2013.01); B29K 2995/0013 (2013.01); F21V 29/246 (2013.01); F21V 19/005 (2013.01); F21V 31/04 (2013.01); B29C 45/0013 (2013.01); F21Y 2101/02 (2013.01); F21V 17/164 (2013.01);
Abstract

In one aspect, an LED lighting apparatus includes an electronic circuit board having a peripheral portion and a central portion that is radially inward of said peripheral portion, said electronic circuit board having an exterior side for optically interfacing with ambient environment during operation and an interior side opposite the exterior side. At least one LED is mounted on the exterior side of the electronic circuit board central portion and a thermally conductive housing encloses said electronic circuit board, said thermally conductive housing formed of a moldable thermally conductive material. The thermally conductive housing defines a first cavity adjacent the central portion of the electronic circuit board exterior side and a second cavity adjacent the central portion of the electronic circuit board interior side, wherein a portion of said thermally conductive housing being overmolded onto said peripheral portion. In a further aspect, a method of manufacturing an LED lighting apparatus is provided.


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