The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 09, 2014

Filed:

Dec. 20, 2011
Applicants:

Syota Shimonishi, Kiyosu, JP;

Hiroyuki Tajima, Kiyosu, JP;

Yosuke Tsuchiya, Kiyosu, JP;

Hideaki Kato, Kiyosu, JP;

Inventors:

Syota Shimonishi, Kiyosu, JP;

Hiroyuki Tajima, Kiyosu, JP;

Yosuke Tsuchiya, Kiyosu, JP;

Hideaki Kato, Kiyosu, JP;

Assignee:

Toyoda Gosei Co., Ltd., Kiyosu-Shi, Aichi-Ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05B 33/08 (2006.01); H05K 1/02 (2006.01); F21Y 105/00 (2006.01); F21K 99/00 (2010.01); F21V 25/10 (2006.01); F21Y 101/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/026 (2013.01); H05K 2203/162 (2013.01); F21Y 2105/001 (2013.01); F21K 9/00 (2013.01); H05K 2201/09381 (2013.01); H05B 33/0821 (2013.01); F21V 25/10 (2013.01); H05K 2201/2054 (2013.01); F21Y 2101/02 (2013.01); H05K 2201/10106 (2013.01); Y02B 20/341 (2013.01); H05K 1/0269 (2013.01);
Abstract

An object of the present invention is to provide a LED module, capable of protecting LED chips from an excessive voltage, at low cost. An LED module for lighting includes a wiring substrate having a plurality of wiring patterns formed thereon, and a plurality of LED chips connected to the wiring patterns so as to constitute a series circuit or a series-parallel circuit. In the LED module, the wiring patterns comprises an anode side wiring pattern constituting an anode side electrode of the circuit, and a cathode side wiring pattern constituting a cathode side electrode of the circuit, the anode side wiring pattern and the cathode side wiring pattern are disposed to surround connection regions of the wiring patterns with the LED chips, and forms guard electrodes, and both edge portions of the anode side wiring pattern face both edge portions of the cathode side wiring pattern with gaps, respectively.


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