The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2014
Filed:
Dec. 21, 2010
Andrew Joseph Detor, Niskayuna, NY (US);
Reed Corderman, New York, NY (US);
Christopher Keimel, Niskayuna, NY (US);
Marco Aimi, Niskayuna, NY (US);
Andrew Joseph Detor, Niskayuna, NY (US);
Reed Corderman, New York, NY (US);
Christopher Keimel, Niskayuna, NY (US);
Marco Aimi, Niskayuna, NY (US);
General Electric Company, Niskayuna, NY (US);
Abstract
A device includes a substrate () and a metallic layer () formed over the substrate () with a deposition process for which the metallic layer () is characterizable as having a pre-determinable as-deposited defect density. As a result of a fabrication process, the defect density of the metallic layer () is reduced relative to the pre-determinable as-deposited defect density of the same layer () or another layer having like composition and which is formed under like deposition conditions. In a related method, a substrate () is provided and a removable layer () is formed over the substrate (). A metallic layer () is formed over the removable layer () and is patterned and etched to define a structure over the removable layer (). The removable layer () is removed, and the metallic layer () is heated for a time beyond that necessary for bonding of a hermetic sealing cap () thereover.