The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
May. 13, 2013
International Business Machines Corporation, Armonk, NY (US);
John Darringer, Mahopac, NY (US);
Jeonghee Shin, Millwood, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A system and method for improving and optimizing current delivery into a chip, which is limited by the physical properties of the connections (e.g., Controlled Collapse Chip Connection or C4s). The system and method enables rapid C4 bump current estimation and placement including generating a one-time computed sensitivity matrix that includes all of the contributions of macros (or groups of components) to C4 current. The system and method further enables the calculation of a C4 current changes using the one-time computed sensitivity matrix and redistributed currents due to deletion of one or more C4 connectors. The system coupled with design and programming methodologies improve and optimize current delivery is extendable to connections across layers in a multilayer 3D chip stack.