The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Jun. 15, 2012
Mohsen Askarinya, Chandler, AZ (US);
Mark R. Boone, Gilbert, AZ (US);
Andreas A. Fenner, Chandler, AZ (US);
Lejun Wang, Chandler, AZ (US);
Kenneth Heames, Mesa, AZ (US);
Mohsen Askarinya, Chandler, AZ (US);
Mark R. Boone, Gilbert, AZ (US);
Andreas A. Fenner, Chandler, AZ (US);
Lejun Wang, Chandler, AZ (US);
Kenneth Heames, Mesa, AZ (US);
Medtronic, Inc., Minneapolis, MN (US);
Abstract
A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.