The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Jan. 18, 2012
Keiji Toh, Kariya, JP;
Shogo Mori, Kariya, JP;
Hideyasu Obara, Kariya, JP;
Nobuhiro Wakabayashi, Oyama, JP;
Shintaro Nakagawa, Oyama, JP;
Shinobu Yamauchi, Oyama, JP;
Keiji Toh, Kariya, JP;
Shogo Mori, Kariya, JP;
Hideyasu Obara, Kariya, JP;
Nobuhiro Wakabayashi, Oyama, JP;
Shintaro Nakagawa, Oyama, JP;
Shinobu Yamauchi, Oyama, JP;
Kabushiki Kaisha Toyota Jidoshokki, Kariya-shi, JP;
Showa Denko K.K., Tokyo, JP;
Abstract
A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.