The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Aug. 18, 2011
Koji Tsuduki, Kawasaki, JP;
Shin Hasegawa, Hadano, JP;
Tadashi Kosaka, Atsugi, JP;
Yasuhiro Matsuki, Atsugi, JP;
Takanori Suzuki, Tokyo, JP;
Akiya Nakayama, Kawasaki, JP;
Koji Tsuduki, Kawasaki, JP;
Shin Hasegawa, Hadano, JP;
Tadashi Kosaka, Atsugi, JP;
Yasuhiro Matsuki, Atsugi, JP;
Takanori Suzuki, Tokyo, JP;
Akiya Nakayama, Kawasaki, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
An image pickup module includes a cover member, an image pickup device chip including photodiodes, a fixing member which is arranged around the image pickup device chip and which connects the cover member and the image pickup device chip together, a rewiring substrate arranged on the side opposite to the cover member of the image pickup device chip, connection members for connecting the image pickup device chip with the rewiring substrate, and a space surrounded by the cover member, the image pickup device chip, and the fixing member. The image pickup device chip includes a semiconductor substrate. The semiconductor substrate includes through-hole electrodes penetrating the substrate. When an area corresponding to the fixing member in the orthogonal projection of the image pickup module with respect to the cover module is defined as a fixed area, the through-hole electrodes and the connection members are arranged in the fixed area.