The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2014

Filed:

Oct. 06, 2009
Applicants:

Noriyuki Fujimori, Suwa, JP;

Kazuaki Kojima, Suwa, JP;

Inventors:

Noriyuki Fujimori, Suwa, JP;

Kazuaki Kojima, Suwa, JP;

Assignee:

Olympus Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); A62B 1/04 (2006.01); A61B 1/04 (2006.01); H04N 5/232 (2006.01); G02B 13/00 (2006.01); G02B 7/02 (2006.01); G02B 23/24 (2006.01); A61B 1/05 (2006.01); A61B 1/00 (2006.01);
U.S. Cl.
CPC ...
G02B 23/243 (2013.01); G02B 13/0085 (2013.01); G02B 13/006 (2013.01); G02B 13/007 (2013.01); G02B 13/0035 (2013.01); G02B 7/02 (2013.01); G02B 13/0065 (2013.01); A61B 1/051 (2013.01); A61B 1/00096 (2013.01); H04N 5/2254 (2013.01);
Abstract

A manufacturing method for an optical unit includes: a step of bonding plural lens wafers, on which optical components are formed, and forming a lens unit wafer including plural lens units; a step of bonding a bending optical element wafer including plural bending optical elements to a first surface of the lens unit wafer such that the plural bending optical elements are respectively opposed to the plural lens units and forming an optical unit wafer; and a step of separating and individualizing the optical unit wafer for each of the lens units and the bending optical elements and manufacturing plural optical units.


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