The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2014

Filed:

Nov. 22, 2010
Applicants:

Franz Rinner, Deutschlandsberg, AT;

Markus Weiglhofer, Werndorf, AT;

Marion Ottlinger, Deutschlandsberg, AT;

Reinhard Gabl, St. Peter, AT;

Martin Galler, Graz, AT;

Christoph Auer, Graz, AT;

Georg Kuegerl, Eibiswald, AT;

Inventors:

Franz Rinner, Deutschlandsberg, AT;

Markus Weiglhofer, Werndorf, AT;

Marion Ottlinger, Deutschlandsberg, AT;

Reinhard Gabl, St. Peter, AT;

Martin Galler, Graz, AT;

Christoph Auer, Graz, AT;

Georg Kuegerl, Eibiswald, AT;

Assignee:

Epcos AG, Munich, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/083 (2006.01); B23K 35/00 (2006.01); H01L 41/293 (2013.01); H01L 41/047 (2006.01); B23K 35/26 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/001 (2013.01); H01L 41/293 (2013.01); H01L 41/0472 (2013.01);
Abstract

A solder material can be used for fastening an outer electrode on a piezoelectric component. The solder material contains tin as the main constituent and at least one addition from the group of cobalt, tungsten, osmium, titanium, vanadium, iron and rare earth metals. A piezoelectric component includes such a solder material. The solder material is applied by means of a base metallization.


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