The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2014

Filed:

Jan. 15, 2010
Applicants:

Matthew B. Jore, Ronan, MT (US);

James David Duford, Polson, MT (US);

Michael Kvam, Polson, MT (US);

Lincoln M. Jore, Ronan, MT (US);

David Samsel, Missoula, MT (US);

James D. Jore, Polson, MT (US);

Inventors:

Matthew B. Jore, Ronan, MT (US);

James David Duford, Polson, MT (US);

Michael Kvam, Polson, MT (US);

Lincoln M. Jore, Ronan, MT (US);

David Samsel, Missoula, MT (US);

James D. Jore, Polson, MT (US);

Assignee:

Boulder Wind Power, Inc., Louisville, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 1/22 (2006.01); H02K 1/27 (2006.01); H02K 21/24 (2006.01); H02K 3/26 (2006.01); H02K 3/47 (2006.01); H02K 1/12 (2006.01);
U.S. Cl.
CPC ...
H02K 21/24 (2013.01); H02K 3/26 (2013.01); H02K 3/47 (2013.01); H02K 1/12 (2013.01); H02K 2211/03 (2013.01); H02K 2203/03 (2013.01);
Abstract

An axial rotary energy device including a segmented stator assembly having a plurality of segments arranged in an annular array. Each stator segment is constructed by stacking a plurality of PCB power conductor layers and a plurality of PCB series layers. Each layer having radial conductors extending from an inner via to an outer via. The vias electrically connect selected radial conductors of the series conductor layer and power conductor layer. Each power conductor layer includes a pair of positive and negative terminal vias for one phase of the electric current connected to selected outer vias. A daughter PCB layer electrically connects two adjacent segments together by having a first portion electrically connected to a negative terminal via located in one segment and a second portion electrically connected to a positive terminal via located in an adjacent segment together with a current conductor electrically connecting the two terminal vias together.


Find Patent Forward Citations

Loading…