The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Sep. 05, 2012
Applicants:
Chul Kim, Gyeonggi-do, KR;
Jong Chern Lee, Gyeonggi-do, KR;
Inventors:
Chul Kim, Gyeonggi-do, KR;
Jong Chern Lee, Gyeonggi-do, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/04 (2006.01); H01L 23/02 (2006.01); H01L 23/12 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 25/0657 (2013.01); H01L 24/06 (2013.01); H01L 2224/05009 (2013.01); H01L 24/16 (2013.01); H01L 2224/05568 (2013.01); H01L 2225/06541 (2013.01); H01L 21/76898 (2013.01); H01L 2224/05647 (2013.01); H01L 2225/06513 (2013.01); H01L 23/481 (2013.01); H01L 2224/05556 (2013.01); H01L 24/05 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/131 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/05557 (2013.01); H01L 21/76885 (2013.01); H01L 2224/13025 (2013.01); H01L 24/13 (2013.01); H01L 2924/37001 (2013.01); H01L 24/03 (2013.01);
Abstract
In a semiconductor apparatus, a plurality of semiconductor chips including through-silicon vias are stacked in a vertical direction, wherein the through-silicon via formed in each semiconductor chip protrudes beyond heights of each semiconductor chip.