The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Sep. 23, 2011
Applicant:
Seong Cheol Kim, Anseong-si, KR;
Inventor:
Seong Cheol Kim, Anseong-si, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 2224/16 (2013.01); H01L 2225/06544 (2013.01); H01L 23/481 (2013.01); H01L 2225/06513 (2013.01);
Abstract
A semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface, a chip pad disposed on the first surface of the substrate, and a through-silicon via (TSV) including a plurality of sub vias electrically connected to the chip pad at different positions.