The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Mar. 29, 2011
Michael O. Jenkins, San Jose, CA (US);
James Karp, Saratoga, CA (US);
Vassili Kireev, Sunnyvale, CA (US);
Ephrem C. Wu, San Mateo, CA (US);
Michael O. Jenkins, San Jose, CA (US);
James Karp, Saratoga, CA (US);
Vassili Kireev, Sunnyvale, CA (US);
Ephrem C. Wu, San Mateo, CA (US);
Xilinx, Inc., San Jose, CA (US);
Abstract
An embodiment of a multichip module is disclosed. For this embodiment of a multichip module, a semiconductor die and an interposer are included. The interposer has conductive layers, dielectric layers, and a substrate. Internal interconnect structures couple the semiconductor die to the interposer. External interconnect structures are for coupling the interposer to an external device. A first inductor includes at least a portion of one or more of the conductive layers of the interposer. A first end of the first inductor is coupled to an internal interconnect structure of the internal interconnect structures. A second end of the first inductor is coupled to an external interconnect structure of the external interconnect structures.