The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Apr. 06, 2011
Hamid Tavassoli, Cupertino, CA (US);
Surajit Kumar, Sunnyvale, CA (US);
Kallol Bera, San Jose, CA (US);
Xiaoping Zhou, San Jose, CA (US);
Shane C. Nevil, Livermore, CA (US);
Douglas A. Buchberger, Jr., Livermore, CA (US);
Hamid Tavassoli, Cupertino, CA (US);
Surajit Kumar, Sunnyvale, CA (US);
Kallol Bera, San Jose, CA (US);
Xiaoping Zhou, San Jose, CA (US);
Shane C. Nevil, Livermore, CA (US);
Douglas A. Buchberger, Jr., Livermore, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.