The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Mar. 02, 2012
Dong Gyu Lee, Seoul, KR;
Jin Won Choi, Gyeonggi-do, KR;
Sung Won Jeong, Gyeongsangnam-do, KR;
Dae Young Lee, Gyeonggi-do, KR;
Gi Sub Lee, Busan, KR;
Jin Ho Kim, Gyeonggi-do, KR;
Dong Gyu Lee, Seoul, KR;
Jin Won Choi, Gyeonggi-do, KR;
Sung Won Jeong, Gyeongsangnam-do, KR;
Dae Young Lee, Gyeonggi-do, KR;
Gi Sub Lee, Busan, KR;
Jin Ho Kim, Gyeonggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Abstract
Disclosed herein are a package substrate and a fabricating method thereof. The package substrate includes a substrate including at least one conductive pad, an insulation layer formed on the substrate and including an opening through which the conductive pad is exposed, a blister prevention layer formed along a top surface of the conductive pad exposed through the opening and a sidewall of the insulation layer, a metal post made of at least one alloy material and formed on the blister prevention layer, and a heat-diffusion prevention film formed on the metal post.